Procesador. . 1st and 2nd Generation Intel® Xeon® Scalable Processors, Dual LGA 3647 Socket P (Square) with 2 UPI support of up to 10.4 GT/s, CPU TDP support up to 165W. . Chipset. . Intel® C621 Chipset. . Memoria. . 8 x DDR4 DIMM sockets supporting up to 1 TB of system memory. 8 channel memory architecture (4 channel per CPU). Support for DDR4 2666 MHz memory modules if use a Skylake CPU. Support for DDR4 2933 MHz memory modules if use a Cascade lake CPU. Support for ECC RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS memory modules. . Gráfica Integrada. . ASPEED® AST2500:. 1 x puerto D-Sub, con una resolución máxima de 1920x1200@60 Hz. . LAN. . 1 x Realtek RTL8211E chip (10/100/1000 Mbit) (LAN1). 2 x Intel® 210AT GbE LAN chips (10/100/1000 Mbit) (LAN2, LAN3). . Zócalos de Expansión. . 2 x PCI Express x16 slots, running at x16 (PCIEX16_3, PCIEX16_5). 1 x PCI Express x16 slot, running at x8 (PCIEX8_1). 2 x PCI Express x8 slots, running at x8 (PCIEX8_2, PCIEX8_6). 1 x PCI Express x8 slot, running at x4 (PCIEX4_4). (All of the PCI Express x16 slots conform to PCI Express 3.0 standard.). Interfaz de almacenamientoChipset:. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe x4/x2 SSD support) (M.2). 8 x SATA 6Gb/s connectors (I-SATA0~I-SATA7). 2 x SATA 6Gb/s connectors (S-SATA0, S-SATA1). Soporta RAID 0, RAID 1, RAID 5, y RAID 10. . USB. . Chipset:. 5 x USB 3.1 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header, 1 port onboard). 2 x puertos USB 2.0/1.1 disponibles a través del conector USB interno. . Conectores Internos E/S. . 1 x 24-pin ATX main power connector. 2 x conector de potencia 8-pin ATX 12V. 2 x CPU fan headers. 6 x conector para ventilador del sistema. 1 x Triple conector socket M.2. 10 x conector SATA 6Gb/s. 2 x SATA DOM power headers. 1 x PMBus connector. 1 x Intel® VROC Upgrade Key header. 1 x front panel header. 1 x cabezal USB 3.1 Gen 1. 1 x USB 3.1 Gen 1 port. 1 x conector USB 2.0/1.1. 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only). La función TPM es opcional según las diferentes políticas locales. 1 x serial port connector. 1 x conector de intrusión en el chasis. 3 x SATA SGPIO headers. 1 x SMD_VMD header. 1 x IPMB connector. 1 x SMB connector. 1 x wake on LAN header. 1 x Clear CMOS jumper. 1 x VGA jumper. 1 x Watch-Dog timer jumper. 1 x VRM SMB Clock jumper. 1 x VRM SMB Data jumper. 1 x UID button. 1 x buzzer. . Panel E/S Trasero. . 1 x puerto D-Sub. 3 x RJ-45 ports. 2 x USB 3.1 Gen 1 ports. . Controlador E/S. . ASPEED® AST2500 BMC chip. . BIOS. . 1 x 256 Mbit flash. Use of licensed AMI BIOS. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0. . Operating Properties. . Operating Temperature: 10ºC to 40ºC. Operating humidity: 8 - 80%. Non-operating temperature: -40ºC to 70ºC. Non-operating humidity: 5% - 95%. . Formato. . CEB Form Factor; 30.5cm x 26.7cm

• CHIPSET: INTEL C621
• FORMATO: CEB
• HDMI: NO
• IMAGEN SALIDA: D-SUB
• MEMORIA MAXIMA: 1TB
• MICROPROCESADOR INTEGRADO: NO
• MULTI-GRAFICA: SIN DATOS
• N BANCOS DE MEMORIA: 8
• N CONEXIONES SATA: 10
• N USB 2.0: 2 INTERNOS
• N USB 3.0: 2 TRASEROS, 2 INTERNOS, 1 ONBOARD
• PCI: 3 PCIe x16 , 3 PCIe x8
• RAID: SI
• SATA 6GB/s: 10
• SOCKET: INTEL P
• SOPORTA OPTANE: NO
• TECNOLOGIA DE MEMORIA: DDR4 ECC
• TIPO DE RAID: 0,1,10
• USB 3.0: SI
• USB3.0 INTERNO: SI